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谦合益邦打造全球首款4层3D DRAM存算一体芯片

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Representative image for 谦合益邦打造全球首款4层3D DRAM存算一体芯片

Merged summary

TL;DR - Chinese chip startup Qianhe Yibang says it has successfully fabricated and powered on the first four-layer 3D DRAM compute-in-memory chip, advancing the design from technical validation toward engineering deployment. Its vertically integrated architecture targets the memory-wall bottleneck in highly parallel, data-intensive workloads such as cloud gaming.

  • The “4+1” design stacks four DRAM layers above a logic layer, tightly integrating compute and storage in three dimensions.
  • The company claims order-of-magnitude improvements in memory bandwidth and throughput, alongside order-of-magnitude reductions in memory-access power, latency, and per-operation cost versus conventional approaches.
  • Four-layer stacking raises significant manufacturing challenges, including yield, thermal management, layer alignment, and vertical-interconnect consistency.
  • Founded in 2024 and incubated by NetEase, Qianhe Yibang recently raised more than RMB 2 billion in Series B funding to support commercialization.

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谦合益邦打造全球首款4层3D DRAM存算一体芯片

雷峰网 (AI科技评论) 2026-08-21
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Providers: Hugging Face · N/A OpenAlex · N/A Publisher · N/A Semantic Scholar · N/A X · N/A Fetched 2026-09-20 14:15:01.867592 UTC

TL;DR - Chinese chip startup Qianhe Yibang says it has successfully fabricated and powered on the first four-layer 3D DRAM compute-in-memory chip, advancing the design from technical validation toward engineering deployment. Its vertically integrated architecture targets the memory-wall bottleneck in highly parallel, data-intensive workloads such as cloud gaming.

  • The “4+1” design stacks four DRAM layers above a logic layer, tightly integrating compute and storage in three dimensions.
  • The company claims order-of-magnitude improvements in memory bandwidth and throughput, alongside order-of-magnitude reductions in memory-access power, latency, and per-operation cost versus conventional approaches.
  • Four-layer stacking raises significant manufacturing challenges, including yield, thermal management, layer alignment, and vertical-interconnect consistency.
  • Founded in 2024 and incubated by NetEase, Qianhe Yibang recently raised more than RMB 2 billion in Series B funding to support commercialization.
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