谦合益邦打造全球首款4层3D DRAM存算一体芯片
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TL;DR - Chinese chip startup Qianhe Yibang says it has successfully fabricated and powered on the first four-layer 3D DRAM compute-in-memory chip, advancing the design from technical validation toward engineering deployment. Its vertically integrated architecture targets the memory-wall bottleneck in highly parallel, data-intensive workloads such as cloud gaming.
- The “4+1” design stacks four DRAM layers above a logic layer, tightly integrating compute and storage in three dimensions.
- The company claims order-of-magnitude improvements in memory bandwidth and throughput, alongside order-of-magnitude reductions in memory-access power, latency, and per-operation cost versus conventional approaches.
- Four-layer stacking raises significant manufacturing challenges, including yield, thermal management, layer alignment, and vertical-interconnect consistency.
- Founded in 2024 and incubated by NetEase, Qianhe Yibang recently raised more than RMB 2 billion in Series B funding to support commercialization.
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谦合益邦打造全球首款4层3D DRAM存算一体芯片
TL;DR - Chinese chip startup Qianhe Yibang says it has successfully fabricated and powered on the first four-layer 3D DRAM compute-in-memory chip, advancing the design from technical validation toward engineering deployment. Its vertically integrated architecture targets the memory-wall bottleneck in highly parallel, data-intensive workloads such as cloud gaming.
- The “4+1” design stacks four DRAM layers above a logic layer, tightly integrating compute and storage in three dimensions.
- The company claims order-of-magnitude improvements in memory bandwidth and throughput, alongside order-of-magnitude reductions in memory-access power, latency, and per-operation cost versus conventional approaches.
- Four-layer stacking raises significant manufacturing challenges, including yield, thermal management, layer alignment, and vertical-interconnect consistency.
- Founded in 2024 and incubated by NetEase, Qianhe Yibang recently raised more than RMB 2 billion in Series B funding to support commercialization.