3D存算一体芯片领军企业谦合益邦完成超20亿元B轮融资

TL;DR - Chinese 3D compute-in-memory chip startup Qianhe Yibang raised over RMB 2 billion in Series B funding to advance its 3D DRAM architecture and commercialization. The technology targets the memory-wall bottleneck by tightly integrating computation and storage.

• Its architecture stacks 3D DRAM to improve bandwidth and latency beyond conventional compute-memory separation.
• The company develops chips alongside a co-designed system software stack.
• Funding will support R&D, product iteration, and commercial deployment.
• Investors include national and industry funds, with NetEase Youdao and China Mobile-linked capital providing deployment and validation opportunities.