3D存算一体芯片领军企业谦合益邦完成超20亿元B轮融资
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Merged summary
TL;DR - Chinese 3D compute-in-memory chip startup Qianhe Yibang raised over RMB 2 billion in Series B funding to advance its 3D DRAM architecture and commercialization. The technology targets the memory-wall bottleneck by tightly integrating computation and storage.
- Its architecture stacks 3D DRAM to improve bandwidth and latency beyond conventional compute-memory separation.
- The company develops chips alongside a co-designed system software stack.
- Funding will support R&D, product iteration, and commercial deployment.
- Investors include national and industry funds, with NetEase Youdao and China Mobile-linked capital providing deployment and validation opportunities.
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3D存算一体芯片领军企业谦合益邦完成超20亿元B轮融资
Public signals
N/A
TL;DR - Chinese 3D compute-in-memory chip startup Qianhe Yibang raised over RMB 2 billion in Series B funding to advance its 3D DRAM architecture and commercialization. The technology targets the memory-wall bottleneck by tightly integrating computation and storage.
- Its architecture stacks 3D DRAM to improve bandwidth and latency beyond conventional compute-memory separation.
- The company develops chips alongside a co-designed system software stack.
- Funding will support R&D, product iteration, and commercial deployment.
- Investors include national and industry funds, with NetEase Youdao and China Mobile-linked capital providing deployment and validation opportunities.